{"id":1217,"date":"2025-08-20T12:35:45","date_gmt":"2025-08-20T10:35:45","guid":{"rendered":"https:\/\/hoenle.cn\/?page_id=1217"},"modified":"2026-01-27T14:11:07","modified_gmt":"2026-01-27T13:11:07","slug":"thermal-management-in-electronics","status":"publish","type":"page","link":"https:\/\/hoenle.cn\/en\/products-solutions\/applications\/bonding-potting\/electronics\/thermal-management-in-electronics\/","title":{"rendered":"Thermal Management in Electronics"},"content":{"rendered":"

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\n Thermal Management<\/span>\n in Electronics<\/span>\n <\/h1>[\/vc_column][vc_column width=”1\/2″][vc_column_text css=””]Thermally conductive adhesives are often used for themal management to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Thermally conductive adhesives are also used as encapsulation compound for temperature sensors for enclosures or reactors. Adhesives with thermal conductivity are synthetic resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers such as silver or graphite. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical insulation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used.[\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column width=”1\/4″][\/vc_column][vc_column width=”1\/4″][\/vc_column][vc_column width=”1\/4″]\n
\n \n Request consultation<\/span>\n <\/a>\n <\/div>[\/vc_column][vc_column width=”1\/4″][vc_column_text css=””]Downloads<\/strong><\/p>\n

Electrically and Thermally Conductive Adhesives brochure<\/a>[\/vc_column_text][\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1758832784194{background-color: #FFFFFF !important;}”][vc_row][vc_column width=”1\/2″][vc_column_text css=””]Hoenle has developed highly efficient silicone-free 2-component TIMs (thermal interface material) especially for dissipating heat from chips and sensors. The heat dissipation significantly increases the service life of chips and sensors. Compared to heat transfer compounds, thermoconductive adhesives have the advantage of holding or mounting components in addition to dissipating thermal energy. Hoenle offers a wide selection of thermally conductive adhesives for thermal management: The spectrum ranges from epoxy resin based single- and two-component adhesives of the Elecolit\u00ae series , which are thermally curing and have a high temperature resistance of up to 200\u00b0C, to acrylate-based UV-curing adhesives of the Vitralit\u00ae line .[\/vc_column_text][\/vc_column][vc_column width=”1\/2″][vc_single_image image=”751″ img_size=”full” add_caption=”yes” css=””][\/vc_column][\/vc_row][vc_row][vc_column][vc_empty_space height=”80px”][vc_column_text css=””]The table below lists a selection of thermally conductive adhesives from Hoenle. Further products and custom solutions are available on request. To download the technical datasheets (TDS) please click on the adhesive name.[\/vc_column_text]\n

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\n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n
\n \n \n Adhesive <\/span>\n \n <\/th>\n \n \n \n Application Areas <\/span>\n \n <\/th>\n \n \n \n Viscosity [mPas] <\/span>\n \n <\/th>\n \n \n \n Base <\/span>\n \n <\/th>\n \n \n \n Curing <\/span>\n \n <\/th>\n \n \n \n Special Properties <\/span>\n \n <\/th>\n <\/tr>\n <\/thead>\n \n \n
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\n \n Elecolit\u00ae 6601<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Sensor bonding<\/li>\n
  • Dissipation of heat<\/li>\n
  • Potting<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 12,000-20,000 (LVT, 25 \u00b0C, Sp. 4\/6 rpm) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n thermally conductive, solvent-free, <\/li>\n
  • \n white color, <\/li>\n
  • \n excellent bonding to metals, <\/li>\n
  • \n very good flow properties <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Elecolit\u00ae 6603<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Dissipation of heat<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 95 000 - 115 000 (LVT, 25 \u00b0C, Sp. 4\/3 rpm) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n thermally conductive <\/li>\n
  • \n grey color <\/li>\n
  • \n very good adhesion to metal <\/li>\n
  • \n excellent flow properties <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Elecolit\u00ae 6616<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 50,000-120,000 (Rheometer, 25 \u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n 2 component epoxy <\/span>\n <\/td>\n \n \n thermal\r\nroom temperature <\/span>\n <\/td>\n \n \n
    \n
  • \n thermally conductive <\/li>\n
  • \n black color <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae 6129<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 4,000-7,000 <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n