{"id":1233,"date":"2025-08-20T13:05:23","date_gmt":"2025-08-20T11:05:23","guid":{"rendered":"https:\/\/hoenle.cn\/?page_id=1233"},"modified":"2026-01-27T14:11:07","modified_gmt":"2026-01-27T13:11:07","slug":"bonding-camera-modules","status":"publish","type":"page","link":"https:\/\/hoenle.cn\/en\/products-solutions\/applications\/bonding-potting\/electronics\/bonding-camera-modules\/","title":{"rendered":"Bonding camera modules"},"content":{"rendered":"

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\n Bonding<\/span>\n camera modules<\/span>\n <\/h1>[\/vc_column][vc_column width=”1\/2″][vc_column_text css=””]In the electronics sector adhesives are used in particular for mobile phone and smartphone camera modules. This includes bonding of individual parts \u2013 such as the lens into the lens mount or the lens mount onto the camera sensor \u2013, fixing the camera chip onto the circuit board (die attach), use of the adhesive as chip underfill, bonding low-pass filters and gluing the assembled camera modules into the device housing.[\/vc_column_text]\n
\n \n Request consultation<\/span>\n <\/a>\n <\/div>[\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1758834255261{background-color: #FFFFFF !important;}”][vc_row][vc_column width=”2\/3″][vc_column_text css=””]Special adhesives allow precise assembly and durable bonding of ever smaller camera module components. The adhesives used are suitable for large-scale production of camera modules and cure quickly at low temperatures.[\/vc_column_text][vc_column_text css=””]The table below lists a selection of adhesives that are recommended for bonding camera modules. Further products and custom solutions are available on request.[\/vc_column_text][vc_column_text css=””]To download the technical datasheets (TDS) please click on the adhesive name.[\/vc_column_text][\/vc_column][vc_column width=”1\/3″][vc_single_image image=”280″ img_size=”full” add_caption=”yes” css=””][vc_column_text css=””][\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column]\n
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\n \n \n Adhesive <\/span>\n \n <\/th>\n \n \n \n Application Areas <\/span>\n \n <\/th>\n \n \n \n Viscosity [mPas] <\/span>\n \n <\/th>\n \n \n \n Base <\/span>\n \n <\/th>\n \n \n \n Curing <\/span>\n \n <\/th>\n \n \n \n Special Properties <\/span>\n \n <\/th>\n <\/tr>\n <\/thead>\n \n \n
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\n \n Vitralit\u00ae UD 5134<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 15,000-25,000 <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nVIS\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n
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  • \n Acrylate-Hybrid <\/li>\n
  • \n low thermal expansion <\/li>\n
  • \n low shrinkage <\/li>\n
  • \n impact resistant <\/li>\n
  • \n dry surface <\/li>\n
  • \n grey color <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
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\n \n Vitralit\u00ae UV 2113<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
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  • Potting<\/li>\n
  • Sealing<\/li>\n
  • Protection of sensitive components<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 19,000-32,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nVIS <\/span>\n <\/td>\n \n \n
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  • \n Acrylate hybrid <\/li>\n
  • \n superior strength <\/li>\n
  • \n low thermal expansion <\/li>\n
  • \n impact resistant <\/li>\n
  • \n low shrinkage <\/li>\n
  • \n resistant to soldering stress <\/li>\n
  • \n excellent flow properties <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
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\n \n Vitralit\u00ae UV 2115<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 20,000-30,000 (Rheometer, 25\u00b0C, 50s^-1) <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nVIS <\/span>\n <\/td>\n \n \n