{"id":1333,"date":"2025-08-20T17:40:19","date_gmt":"2025-08-20T15:40:19","guid":{"rendered":"https:\/\/hoenle.cn\/?page_id=1333"},"modified":"2026-01-27T14:11:08","modified_gmt":"2026-01-27T13:11:08","slug":"flip-chip-underfill","status":"publish","type":"page","link":"https:\/\/hoenle.cn\/en\/products-solutions\/applications\/bonding-potting\/pcb\/flip-chip-underfill\/","title":{"rendered":"Flip Chip Underfill"},"content":{"rendered":"

[vc_section][vc_row][vc_column width=”1\/2″]\n

\n Flip Chip<\/span>\n Underfills<\/span>\n <\/h1>[\/vc_column][vc_column width=”1\/2″][vc_column_text css=””]In modern electronics manufacturing, the demands on the mechanical stability and reliability of electronic components are constantly increasing. Particularly in highly integrated assemblies such as flip chips or ball grid arrays (BGA), additional stabilization is crucial for a long service life and reliable function. This is where so-called underfills come into play\u2014special adhesives that have been specifically developed to compensate for mechanical stresses and improve the thermal resilience of soldered joints.[\/vc_column_text]\n
\n \n Request consultation<\/span>\n <\/a>\n <\/div>[\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1757770302065{background-color: #FFFFFF !important;}”][vc_row][vc_column width=”2\/3″][vc_column_text css=””]To improve thermal properties, modern underfiller adhesives are equipped with nanofillers. These reduce the coefficient of thermal expansion (CTE) and thus increase reliability\u2014a decisive advantage in temperature-sensitive applications.<\/p>\n

Epoxy resin-based adhesives are often used because of their impressive capillary flow behavior. They penetrate independently into the narrow spaces between the chip and the circuit board, enabling easy and complete application \u2013 even with complex structures.<\/p>\n

Dual-curing underfill systems are particularly efficient. The adhesive is first fixed in the edge area by UV light before complete heat curing takes place in the shadow zones under the component. This two-stage process ensures reliable and complete curing.<\/p>\n

The targeted use of high-quality underfill adhesives can significantly improve the mechanical strength, thermal stability, and long-term reliability of electronic components. This makes them an indispensable part of modern electronics manufacturing\u2014from smartphones to power electronics.[\/vc_column_text][\/vc_column][vc_column width=”1\/3″][vc_single_image image=”1594″ img_size=”full” css=””][vc_column_text css=””]Adhesives serve as underfills for flip chips on printed circuit boards[\/vc_column_text][vc_empty_space][vc_column_text css=””]Download<\/strong><\/p>\n

Smart Adhesive Solutions on PCBs brochure<\/a>[\/vc_column_text][\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1758835755680{background-color: #F2F4F6 !important;}”][vc_row][vc_column width=”1\/3″][vc_single_image image=”14244″ img_size=”full” css=””][vc_column_text css=””]A black, yellow-fluorescent underfill under normal (left) and UV light (right) in comparison[\/vc_column_text][\/vc_column][vc_column width=”2\/3″]\n

\n Sustainability thanks to<\/span>\n reworkability and recycling<\/span>\n <\/h2>[vc_column_text css=””]Reworkability makes it possible to process, repair, or recycle products after assembly. This is becoming increasingly important for manufacturers of electronic components, as legislation and environmental organizations continue to push for the minimization of electronic waste. One starting point for sustainable strategies is the reworkability and repairability of individual modules on printed circuit boards in order to counteract the scrapping of entire components or modules.<\/p>\n

Some underfill adhesives from Hoenle are specially designed for this \u201creworkability\u201d: they can be removed again when exposed to temperatures above the glass transition range of 150\u00b0C. Up to this temperature and application range, the epoxy resins adhere reliably. Only above this critical temperature threshold does the product become reworkable. To make the adhesives easily recognizable, the black adhesives fluoresce yellow when exposed to short-wave light.[\/vc_column_text][\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1757774087346{background-color: #F2F4F6 !important;}”][vc_row][vc_column][vc_column_text css=””]The table below provides an overview of Hoenle adhesives that are used as underfill. To download the\u00a0technical datasheets (TDS)\u00a0<\/strong>please click on the adhesive name.[\/vc_column_text]\n

\n \n \n \n \n
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\n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n
\n \n \n Adhesive <\/span>\n \n <\/th>\n \n \n \n Application Areas <\/span>\n \n <\/th>\n \n \n \n Viscosity [mPas] <\/span>\n \n <\/th>\n \n \n \n Base <\/span>\n \n <\/th>\n \n \n \n Curing <\/span>\n \n <\/th>\n \n \n \n Special Properties <\/span>\n \n <\/th>\n <\/tr>\n <\/thead>\n \n \n
\n
\n \n Vitralit\u00ae 2655<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 150-300 <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n UV\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n
    \n
  • \n flexible <\/li>\n
  • \n capillary flow <\/li>\n
  • \n high ion purity <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5751<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 200-500 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Black color, fluorescent yellow, jetable, low ion content, reworkable above 150\u00b0C <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
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\n \n Structalit\u00ae 8202<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 300-400 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n