{"id":1339,"date":"2025-08-20T17:41:23","date_gmt":"2025-08-20T15:41:23","guid":{"rendered":"https:\/\/hoenle.cn\/?page_id=1339"},"modified":"2026-01-27T14:11:09","modified_gmt":"2026-01-27T13:11:09","slug":"attaching-components-on-pcbs","status":"publish","type":"page","link":"https:\/\/hoenle.cn\/en\/products-solutions\/applications\/bonding-potting\/pcb\/attaching-components-on-pcbs\/","title":{"rendered":"Attaching Components on PCBs"},"content":{"rendered":"

[vc_section][vc_row][vc_column width=”1\/2″]\n

\n Attaching Components<\/span>\n on PCBs<\/span>\n <\/h1>[\/vc_column][vc_column width=”1\/2″][vc_column_text css=””]Before soldering processes, chips or SMDs (surface mounted devices) are often attached to the PCB (printed circuit board) with UV-curing adhesive. This allows, for example, several chips or other components to be glued onto on a circuit board within just a few seconds to prevent their falling or sliding out of position on the PCB. The secured chips can then be reflow-soldered in a single work step, which saves time and speeds up production.[\/vc_column_text]\n
\n \n Request consultation<\/span>\n <\/a>\n <\/div>[\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1758835933137{background-color: #FFFFFF !important;}”][vc_row][vc_column width=”2\/3″][vc_column_text css=””]Hoenle’s adhesives for SMD assembly have been developed specially to cure rapidly at exposure to heat or under UV light. Once cured, the adhesives in the table below are short-term temperature-resistant and therefore suitable for holding components before and during reflow soldering onto PCBs.[\/vc_column_text][vc_column_text css=””]On request these adhesives are also available with red or fluorescent pigment to facilitate quality and application monitoring. Their red color or fluorescence makes the adhesive clearly visible to allow the bond quality of every component to be easily inspected also in mass production. Especially the red color creates a clear contrast to the usually green PCBs.[\/vc_column_text][\/vc_column][vc_column width=”1\/3″][vc_single_image image=”1626″ img_size=”full” add_caption=”yes” css=””][vc_empty_space][vc_column_text css=””]Downloads<\/strong><\/p>\n

Smart Adhesive Solutions for PCBs brochure<\/a><\/p>\n

[\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column][vc_column_text css=””]The table below lists a selection of Hoenle adhesives that are suitable for holding components on PCBs and for reflow soldering. Further products and custom solutions are available on request.<\/p>\n

[\/vc_column_text][vc_column_text css=””]To download the technical datasheets (TDS) please click on the adhesive name.[\/vc_column_text]\n

\n \n \n \n \n
\n
\n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n
\n \n \n Adhesive <\/span>\n \n <\/th>\n \n \n \n Application Areas <\/span>\n \n <\/th>\n \n \n \n Viscosity [mPas] <\/span>\n \n <\/th>\n \n \n \n Base <\/span>\n \n <\/th>\n \n \n \n Curing <\/span>\n \n <\/th>\n \n \n \n Special Properties <\/span>\n \n <\/th>\n <\/tr>\n <\/thead>\n \n \n
\n
\n \n Vitralit\u00ae UV 2115<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 20,000-30,000 (Rheometer, 25\u00b0C, 50s^-1) <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nVIS <\/span>\n <\/td>\n \n \n
    \n
  • \n Acrylate hybrid <\/li>\n
  • \n superior strength <\/li>\n
  • \n low thermal expansion <\/li>\n
  • \n low shrinkage <\/li>\n
  • \n impact resistant <\/li>\n
  • \n resistant to soldering stress <\/li>\n
  • \n paste-like <\/li>\n
  • \n stable and high viscous <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae 6104 VT<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 8,000-17,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n
    \n
  • \n Very high adhesion to metals and sintered materials <\/li>\n
  • \n ideal for bonding large components on circuit boards (corner bonding) <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae UD 8055<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Protective encapsulation of electronic components on PCBs<\/li>\n
  • Consumer electronics<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 5,000-8,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV\r\nVIS\r\nmoisture cure <\/span>\n <\/td>\n \n \n
    \n
  • \n High Tg <\/li>\n
  • \n Fast curing <\/li>\n
  • \n Compatible with flux <\/li>\n
  • \n Low ion content <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae UD 8056<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Consumer Electronics<\/li>\n
  • Protective encapsulation of electronic components on PCBs<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 3,000-6,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n acrylate <\/span>\n <\/td>\n \n \n UV \/ VIS \/ Moisture postcuring <\/span>\n <\/td>\n \n \n
    \n
  • \n High Tg, fast curing <\/li>\n
  • \n Compatible with flux <\/li>\n
  • \n Low ion content <\/li>\n
  • \n Passed UL94 HB test <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae UD 2018<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 11,000-25,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n UV\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n
    \n
  • \n Resistant to temperature cycles <\/li>\n
  • \n low shrinkage <\/li>\n
  • \n low thermal expansion coefficient <\/li>\n
  • \n red color <\/li>\n
  • \n pink fluorescent <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 3060-1<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 7,000-10,000 (Rheometer, 25 \u00b0C, 10^s-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n non-conductive <\/li>\n
  • \n high flexibility <\/li>\n
  • \n very fast curing <\/li>\n
  • \n very low ion content <\/li>\n
  • \n high bond strength to several substrates <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5604<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 25,000-40,000 (Rheometer, 25 \u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Fast curing <\/li>\n
  • \n red color <\/li>\n
  • \n fixing components on PCBs <\/li>\n
  • \n SMD applications <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5606 F<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 22 000 - 30 000 (LVT, Sp. 4\/6 rpm) <\/span>\n <\/td>\n \n \n Epoxy <\/span>\n <\/td>\n \n \n Thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n 1part epoxy, fluorescing bluish <\/li>\n
  • \n Fast curing at low temperatures <\/li>\n
  • \n High shock resistance <\/li>\n
  • \n Short time resistant to soldering temperatures up to 270\u00b0 C <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5705<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n -\n <\/span>\n <\/td>\n \n \n 7,000-12,000 <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n