{"id":1356,"date":"2025-08-20T17:41:39","date_gmt":"2025-08-20T15:41:39","guid":{"rendered":"https:\/\/hoenle.cn\/?page_id=1356"},"modified":"2026-01-27T14:11:09","modified_gmt":"2026-01-27T13:11:09","slug":"frame-and-fill-adhesives","status":"publish","type":"page","link":"https:\/\/hoenle.cn\/en\/products-solutions\/applications\/bonding-potting\/pcb\/frame-and-fill-adhesives\/","title":{"rendered":"Frame&Fill Adhesives"},"content":{"rendered":"

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\n Frame&Fill<\/span>\n Adhesives<\/span>\n <\/h1>[\/vc_column][vc_column width=”1\/2″][vc_column_text css=””]Frame-and-fill processes are used to protect highly sensitive areas or sensitive information on electronic circuit boards. In the first step, a high-viscosity barrier \u2013 the so-called frame \u2013 is applied. In the next step, this area is filled with low-viscosity filler material \u2013 the fill. Frame and fill offers two primary advantages: Barrier and potting (fill) heights can be kept to a minimum, and the frame and fill combine to form a homogeneous protective coating. With this precise process, specific areas on the PCB can be protected from mechanical and environmental impact factors.[\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column width=”1\/4″][\/vc_column][vc_column width=”1\/4″][\/vc_column][vc_column width=”1\/4″]\n
\n \n Request consultation<\/span>\n <\/a>\n <\/div>[\/vc_column][vc_column width=”1\/4″][vc_column_text css=””]Downloads<\/strong><\/p>\n

Smart Adhesive Solutions for PCBs brochure<\/a>[\/vc_column_text][\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1757775320898{background-color: #FFFFFF !important;}”][vc_row][vc_column width=”2\/3″][vc_column_text css=””]Structalit\u00ae frame&fill adhesives from Hoenle are formulated to be completely compatible with each other. Both materials can be optimally dispensed wet-on-wet. The highly thixotropic frame prevents the lower viscosity fill from migrating into undesired areas on the PCB. The frame and fill are then cured in a single step.[\/vc_column_text][vc_column_text css=””]Structalit\u00ae brand frame&fill adhesives are black, one-component epoxy resin adhesives that cure thermally. They have a high glass transition temperature, are extremely scratch and chemical resistant, and do not bleed.[\/vc_column_text][vc_column_text css=””]Hoenle also offers Vitralit\u00ae brand adhesives, which are translucent, UV-curing epoxy-based frame&fill materials. These UV-curable adhesives can likewise be dispensed wet-on-wet and then cured in seconds under UV or UV LED light. These UV epoxy resins are equally robust against temperature and environmental influences. Some of these UV-curable adhesives can be thermally post-cured to ensure that the adhesive also polymerizes reliably in shadowed areas or when applied in thicker layers. The advantage of UV-curable frame&fills is their fast curing at low temperature. Rigid and flexible circuit boards containing temperature-sensitive components can be processed in-line, in a continuous production flow.<\/p>\n

[\/vc_column_text][vc_column_text css=””]Hoenle offers frame&fill adhesives with a low ion content with less than 20 ppm, making them particularly suitable for chip encapsulation on electronic circuit boards.<\/p>\n

[\/vc_column_text][vc_column_text css=””][\/vc_column_text][\/vc_column][vc_column width=”1\/3″][vc_single_image image=”1678″ img_size=”full” add_caption=”yes” css=””][\/vc_column][\/vc_row][\/vc_section][vc_section css=”.vc_custom_1757775333656{background-color: #F2F4F6 !important;}”][vc_row][vc_column][vc_column_text css=””]In the following tables you will find a selection of Hoenle adhesives suitable for Frame&Fill applications. Other products or customized solutions are available on request. Technical data sheets can be downloaded by clicking on the adhesive name.<\/p>\n

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\n \n \n \n \n
\n
\n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n
\n \n \n Adhesive <\/span>\n \n <\/th>\n \n \n \n Application Areas <\/span>\n \n <\/th>\n \n \n \n Viscosity [mPas] <\/span>\n \n <\/th>\n \n \n \n Base <\/span>\n \n <\/th>\n \n \n \n Curing <\/span>\n \n <\/th>\n \n \n \n Special Properties <\/span>\n \n <\/th>\n <\/tr>\n <\/thead>\n \n \n
\n
\n \n Structalit\u00ae 5704<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Frame-material for Frame&Fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 60,000-100,000 (Rheometer, 25 \u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n black color <\/li>\n
  • \n stable frame <\/li>\n
  • \n suitable in combination with Structalit 5717-5721 <\/li>\n
  • \n no bleeding <\/li>\n
  • \n very low ion content ( <\/li>\n
  • \n high glass transition temperature <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5717<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Fill-material for Frame&Fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 3,000-8,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Black color, very good flowability <\/li>\n
  • \n High glass transition temperature <\/li>\n
  • \n No bleeding <\/li>\n
  • \n Very low ionic content ( <\/li>\n
  • \n Suitable for semiconductors <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5719<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Fill-material for Frame&Fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 7,000-11,000 (Rheometer, 25\u00b0C, 5s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Very good flowability <\/li>\n
  • \n High glass transition temperature <\/li>\n
  • \n No bleeding <\/li>\n
  • \n Very low ionic content ( <\/li>\n
  • \n Suitable for semiconductors <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5720<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Fill-material for Frame&Fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 10,000-15,000 (Rheometer, 25\u00b0C, 5s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Very good flowability <\/li>\n
  • \n High glass transition temperature <\/li>\n
  • \n No bleeding <\/li>\n
  • \n Very low ionic content ( <\/li>\n
  • \n suitable for semiconductors <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5891 T<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Frame-material for frame&fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 80,000-150,000 (Rheometer, 25 \u00b0C, 10s^-1 ) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Black color <\/li>\n
  • \n stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking <\/li>\n
  • \n stable edges <\/li>\n
  • \n resistant to shocks <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5791<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Frame-material for "Frame&Fill"<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 45,000-65,000 <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n black color <\/li>\n
  • \n excellent shock resistance <\/li>\n
  • \n low halogen content <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5893<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • needle bonding<\/li>\n
  • plastic bonding<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 6,000-10,000 (Rheometer, 25\u00b0C, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Black color <\/li>\n
  • \n excellent flow properties <\/li>\n
  • \n filling material for frame&fill applications <\/li>\n
  • \n high resistance to heat and chemicals <\/li>\n
  • \n certified to ISO 10993-5 standards <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Structalit\u00ae 5894 M<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Glob top encapsulation<\/li>\n
  • Encapsulation of electronic components<\/li>\n
  • Bonding of electronic components<\/li>\n
  • Fill material for frame&fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 20,000-30,000 (Rheometer, 25 \u00b0C, 20s ^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n thermal <\/span>\n <\/td>\n \n \n
    \n
  • \n Black color <\/li>\n
  • \n excellent flow properties <\/li>\n
  • \n filling material for frame and fill applications on PCBs, <\/li>\n
  • \n very high resistance to heat and chemicals <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae 1671<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Frame material for frame & fill applications<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 9,000-14,000 (Rheometer, 10s^-1) <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n UV\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n
    \n
  • \n Stable frame compound <\/li>\n
  • \n high ion purity <\/li>\n
  • \n electronic grade adhesive <\/li>\n
  • \n high temperature conductivity <\/li>\n
  • \n low water absorption <\/li>\n
  • \n UL94 HB test passed <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae 1650<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Fill for frame&fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 3,000-5,000 <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n UV <\/span>\n <\/td>\n \n \n
    \n
  • \n Electronic grade <\/li>\n
  • \n low ion content <\/li>\n
  • \n suitable for chip protection <\/li>\n
  • \n UL94 HB test passed <\/li>\n <\/ul>\n <\/span>\n <\/td>\n <\/tr>\n
\n
\n \n Vitralit\u00ae 1691<\/strong>\n \n <\/a>\n <\/div>\n <\/td>\n
\n \n
    \n
  • Fill for frame&fill<\/li>\n <\/ul>\n <\/span>\n <\/td>\n
\n \n 20,000-40,000 <\/span>\n <\/td>\n \n \n epoxy <\/span>\n <\/td>\n \n \n UV\r\nsecondary heat cure <\/span>\n <\/td>\n \n \n