连接组件关于多氯联苯

在焊接工艺之前，芯片或 SMD（表面贴装器件）通常使用紫外线固化胶粘剂粘附到 PCB（印刷电路板）上。例如，这样就能在几秒钟内将多个芯片或其他元件粘在电路板上，防止它们在印刷电路板上掉落或滑脱。然后，固定好的芯片可在一个工作步骤中进行回流焊接，从而节省时间并加快生产速度。

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Hoenle 用于 SMD 组装的粘合剂经过专门开发，可在受热或紫外线照射时快速固化。一旦固化，下表中的粘合剂可在短期内耐高温，因此适用于在印刷电路板回流焊之前和回流焊过程中固定元件。

根据要求，这些粘合剂还可添加红色或荧光颜料，以方便质量和应用监测。它们的红色或荧光使粘合剂清晰可见，以便在批量生产中也能轻松检查每个元件的粘合质量。特别是红色与通常的绿色印刷电路板形成了鲜明的对比。

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Smart Adhesive Solutions for PCBs brochure

下表列出了部分适用于 PCB 上元件固定和回流焊接的 Hoenle 粘合剂。如需更多产品和定制解决方案，请联系我们。

要下载技术数据表 (TDS)，请单击粘合剂名称。

Adhesive	Application Areas	Viscosity [mPas]	Base	Curing	Special Properties
Vitralit® UV 2115	-	20,000-30,000 (Rheometer, 25°C, 50s^-1)	acrylate	UV VIS	Acrylate hybrid superior strength low thermal expansion low shrinkage impact resistant resistant to soldering stress paste-like stable and high viscous
Vitralit® 6104 VT	-	8,000-17,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV secondary heat cure	Very high adhesion to metals and sintered materials ideal for bonding large components on circuit boards (corner bonding)
Vitralit® UD 8055	Protective encapsulation of electronic components on PCBs Consumer electronics	5,000-8,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV VIS moisture cure	High Tg Fast curing Compatible with flux Low ion content
Vitralit® UD 8056	Consumer Electronics Protective encapsulation of electronic components on PCBs	3,000-6,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV / VIS / Moisture postcuring	High Tg, fast curing Compatible with flux Low ion content Passed UL94 HB test
Vitralit® UD 2018	-	11,000-25,000 (Rheometer, 25°C, 10s^-1)	epoxy	UV secondary heat cure	Resistant to temperature cycles low shrinkage low thermal expansion coefficient red color pink fluorescent
Structalit® 3060-1	-	7,000-10,000 (Rheometer, 25 °C, 10^s-1)	epoxy	thermal	non-conductive high flexibility very fast curing very low ion content high bond strength to several substrates
Structalit® 5604	-	25,000-40,000 (Rheometer, 25 °C, 10s^-1)	epoxy	thermal	Fast curing red color fixing components on PCBs SMD applications
Structalit® 5606 F	-	22 000 - 30 000 (LVT, Sp. 4/6 rpm)	Epoxy	Thermal	1part epoxy, fluorescing bluish Fast curing at low temperatures High shock resistance Short time resistant to soldering temperatures up to 270° C
Structalit® 5705	-	7,000-12,000	epoxy	thermal	Black color, yellow fluorescent, reworkable above 150°C, jettable, low in halogens, very suitable as edge bonding adhesive